PC28F512M29EWLA

Orderable parts

PC28F512M29EWLA

Specs

  • Block Config
    Low Lock
  • Chipset Validation
    N/A
  • Density
    512Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    M29EW
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8/x16

Data Sheets

M29EW 256Mb, 512Mb, 1Gb, 2Gb, 3V Parallel NOR Flash: M29EW

(x8/x16), 3V, Uniform Block, Parallel NOR Flash
  • File Type: PDF
  • Updated: 2016-11-29T06:00:00.0000000Z

AN 308031: M29EW Secure Datasheet Addendum

M29EW Secure Datasheet Addendum
  • File Type: PDF
  • Updated: 2011-09-14T00:00:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2019

Simulation Models

M29EW_Verilog, 512Mb, 65nm, v1.3

  • File Type: ZIP
  • Updated: 2011-02-21T00:00:00.0000000Z

M29EW_IBIS, 512Mb, 65nm, FBGA64, 2.7-3.6V, v1.02

  • File Type: IBS
  • Updated: 2011-05-17T00:00:00.0000000Z

Technical Notes

TN-13-12: Software Driver for M29EW NOR Flash Memory

This technical note describes the C library source code for the Micron M29EW parallel NOR Flash memory device using the Flash device driver software interface V3. Download the low-level driver described in this document here.
  • File Type: PDF
  • Updated: 2015-04-26T05:00:00.0000000Z

TN-13-37: Migrating from Micron M29EW Devices to MT28EW NOR Flash Devices

This technical note describes the process for converting a system design from the Micron M29EW devices to MT28EW single-level cell NOR Flash devices, including 128Mb, 256Mb, 512Mb, and 1Gb densities. PCN's 32162, 32163
  • File Type: PDF
  • Updated: 2014-09-10T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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