M58WR064KB70ZB6F

Orderable parts

M58WR064KB70ZB6F

Specs

  • Block Config
    Bottom Boot
  • Chipset Validation
    N/A
  • Density
    64Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    M58WR
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x16

Data Sheets

Data Sheet: M58WRxxxKTB - 16, 32 and 64Mb (x16, multiple bank, burst) 1.8V, Discrete

M58WR032KT, M58WR064KT, M58WR032KB, M58WR064KB; used in Non-Mux 88-ball JX68, JX69, JXB8
  • File Type: PDF
  • Updated: 2011-10-20

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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