Orderable parts



  • Block Config
    Bottom Boot
  • Chipset Validation
  • Density
  • FBGA Code
  • Op. Temp.
    -40C to +125C
  • Part Family
  • Part Status
  • PLP
  • PLP Start Date
  • Width

Data Sheets

16Mb, 32Mb 3.3V Parallel NOR Flash: M58BW16F, M58BW32F

16Mb, 32Mb, x32, 3.3V, Boot Block, Burst, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 2018-06-25T05:00:00.0000000Z


China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 3/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 3/1/2019

Simulation Models

M58BW_Verilog, 32F, 110nm, v1.2

M58BW32F, 32Mb
  • File Type: ZIP
  • Updated: 2010-05-07T00:00:00.0000000Z

m58bw32f_lbga80.ibs - IBIS Model, M58BW32F, 32Mb, T=125C, LBGA 80-ball

  • File Type: IBS
  • Updated: 2013-04-04T09:43:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2018-02-15T06:00:00.0000000Z

TN-00-25: Enabling a Flash Memory Device into the Linux MTD

This technical note introduces the Linux memory technology device (MTD) architecture and provides a basis for understanding how to enable new devices and new features into the Linux MTD.
  • File Type: PDF
  • Updated: 2013-05-10T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2018-10-12T05:00:00.0000000Z

Micron 95nm Legacy 256Mb and 512Mb DRAM Component Update

Describes certain legacy products.
  • File Type: PDF
  • Updated: 2015-01-09T06:00:00.0000000Z