Orderable parts



  • Block Config
    High Lock
  • Chipset Validation
  • Density
  • FBGA Code
  • Op. Temp.
    -40C to +85C
  • Part Family
  • Part Status
    End of Life
  • PLP
  • PLP Start Date
  • Width

Data Sheets

256Mb 3V Parallel NOR Flash: M29W256GH/GL

256Mb (32Mb x8 or 16Mb x16), 3V, Page, Uniform Block, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 2018-02-09T06:00:00.0000000Z

ERRATA - 256Mb 3V Parallel NOR Flash: M29W256GH/GL

Errata for EDP after erase on M29W256G date codes 1506 and 1512-1552
  • File Type: PDF
  • Updated: 2016-01-15T00:00:00.0000000Z


China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2019

Simulation Models

M29W256G/M29W256GS IBIS model, 65nm, 1.65-3.6V(80ns)/2.7-3.6V(70ns), v1.2

  • File Type: ZIP
  • Updated: 2014-02-20T02:22:00.0000000Z

M29W_Verilog, 256G, 65nm, vg12

M29W256G 256Mb
  • File Type: GZ
  • Updated: 2012-04-17T11:53:00.0000000Z

Technical Notes

TN-13-07: Patching the Linux Kernel and U-Boot for Micron M29 Flash Memory

This technical note provides a guide for modifying the memory technology device (MTD) layer software for the purpose of correctly using Micron M29 family Flash memory devices in a Linux environment. This document also describes the modifications required to make a Linux environment work with M29 Flash memory devices.
  • File Type: PDF
  • Updated: 2011-04-05T05:00:00.0000000Z

TN-13-14: Software Device Drivers for Micron M29W256 NOR Flash Memory

This technical note describes the library source code in C for the M29W256 Flash memory device using the Flash software device driver interface. Download the low-level driver described in this document here.
  • File Type: PDF
  • Updated: 2011-03-08T06:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z