Orderable parts



  • Block Config
    Bottom Boot
  • Chipset Validation
  • Density
  • FBGA Code
  • Op. Temp.
    -40C to +85C
  • Part Family
  • Part Status
    End of Life
  • PLP
  • PLP Start Date
  • Width

Data Sheets

16Mb 3V Parallel NOR Flash: M29W160EB, M29W160ET

16Mb (2Mb x8 or 1Mb x16), 3V, Boot Block, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 2018-02-09T06:00:00.0000000Z


China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 6/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 6/1/2019

Simulation Models

M29W_IBIS, 160ET/EB_ZA6, 110nm (T9HX), TFBGA64, 2.7-3.6V, v1.1

  • File Type: ZIP
  • Updated: 2012-07-31T06:03:00.0000000Z

M29W_Verilog, 160ET/EB, v1.2

M29W160EBT 16Mb
  • File Type: GZ
  • Updated: 2015-09-02T00:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17T15:39:00.0000000Z

AN 309007: Migrating to Numonyx M29W160E Devices from Spansion S29AL016D/J/M and S29GL016A Devices.

Application Note 309007
  • File Type: PDF
  • Updated: 2010-11-09T00:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z