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The growing demands of mobile computing and data centers continue to drive the need for high-capacity, high-performance NAND flash technology. With planar NAND nearing its practical scaling limits, delivering to those requirements has become more difficult with each generation. Enter our 3D NAND technology, which uses an innovative process architecture to provide 3X the capacity of planar NAND technologies while providing better performance and reliability.

System designers who build products like laptops, mobile devices and servers can take advantage of 3D NAND’s unprecedented performance to meet the rising data movement needs for businesses and consumers.

By Density

Density Bits/Cell Width Voltage Package Pin Count Op Temp
8Tb TLC x8 3.3V LBGA 132-ball 0C to +70C
6Tb TLC x8 3.3V LBGA 132-ball 0C to +70C
4Tb TLC x8 3.3V LBGA 132-ball 0C to +70C
3Tb TLC x8 3.3V LBGA 132-ball 0C to +70C
2Tb TLC, MLC x8 3.3V VBGA, LBGA 132-ball 0C to +70C
1Tb TLC, MLC x8 3.3V VBGA 132-ball 0C to +70C
768Gb TLC x8 3.3V VBGA 132-ball 0C to +70C
512Gb TLC, MLC x8 3.3V VBGA, Wafer, TSOP 132-ball, n/a, 48-pin 0C to +70C
384Gb TLC x8 3.3V VBGA 132-ball 0C to +70C
256Gb TLC, MLC x8 3.3V Wafer, TSOP, VBGA n/a, 48-pin, 132-ball 0C to +70C
View Full 3D NAND Flash Part Catalog

Featured Products


Mobile TLC 3D NAND

>> Learn More

If you’re designing a next-generation mobile user experience, Micron’s innovative 64-layer triple-level cell (TLC) 3D NAND technology solves the storage performance challenge.

How Our 3D NAND Works

We’re the first to employ floating gate cell technology in 3D NAND—a proven cell technology that enables better performance, quality, and reliability. We stack 32 storage tiers to achieve the highest-capacity NAND die available today: 256Gb multilevel cell (MLC) and 384Gb triple-level cell (TLC) 3D NAND.

This vertical approach lets us expand the size of each 3D NAND cell—the lithography is actually larger than our latest planar NAND. The larger NAND cells improve both performance and endurance to the point where we expect our MLC 3D NAND parts will meet or exceed the endurance rates of our 20nm NAND—and our TLC 3D NAND will better satisfy demanding data center storage applications.

Read our 3D NAND FAQs to learn more

Benefits to Your Innovation

Our 3D NAND solutions will help bring significant performance, power, and capacity advantages to your storage application. 3D NAND lets you:

Pack in More Capacity
Get 3 times the capacity of existing planar NAND products—enough to enable 3.5TB gum stick-sized SSDs or more than 10TB in standard 2.5-inch SSDs.

Boost Performance
Achieve significantly higher read/write bandwidth and I/O speeds, as well as improved random read performance, thanks to our 3D NAND’s fast 4K read mode.

Save Power
Reduce power consumption significantly in standby mode thanks to 3D NAND’s new sleep mode features that cut power to inactive NAND die (even when other die in the same package are active).

Choosing the Right NAND

With the plethora of NAND flash solutions in the market today, it’s important to understand what each has to offer so you can pick the best choice for your application. Our Choosing the Right NAND page gives a basic overview of NAND flash in its many forms — including SLC, MLC, TLC and NAND for SSDs — helping you weigh your options, and choose what’s best for you.

Start Comparing Your NAND Options

TLC, MLC and SLC Devices

Micron 3D NAND is offered in TLC and MLC devices. Learn how cell density (TLC, MLC and SLC) affects the performance and features of a NAND flash device — so you can choose the right type of NAND for your application.

Compare TLC, MLC and SLC Devices


Eighteen months after the groundbreaking ceremony, we marked the grand opening of our Fab 10 expanded NAND flash memory fabrication facility in Singapore this week. At the opening ceremony, we welcomed over 400 guests including customers, business partners and local government...
  • Updated: 09/29/2016