MT29TZZZAD8DKKBT-107 W

Orderable parts

MT29TZZZAD8DKKBT-107 W.9F8

Specs

  • Chipset Validation
    N/A
  • FBGA Code
    JZ049
  • Op. Temp.
    -25C to +85C
  • Part Status
    Contact Factory
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A

Data Sheets

221-Ball MCP: e.MMC and Mobile LPDDR3

64GB (4xB05A) e.MMC (PS8226 100s v5.1) and 32Gb LPDDR3 (4xV01M) MT29TZZZAD8DKKBT-107 W.9F8 (221b; J9F8)
  • File Type: PDF
  • Updated: 2020-04-17

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 11/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 11/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2020

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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