MT29TZZZ8D6YKEAH-125 W

Orderable parts

MT29TZZZ8D6YKEAH-125 W.96S

Specs

  • Chipset Validation
    N/A
  • FBGA Code
    JY953
  • Op. Temp.
    -25C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A

Data Sheets

221-Ball MCP: MLC eMMC and Mobile LPDDR3

16GB (2 x L84D) eMMC (PS8222 80s PB v5.0) and 8Gb LPDDR3 (1 x V91M) MT29TZZZ8D6YKEAH-125 W.96S
  • File Type: PDF
  • Updated: 2015-03-24

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
See All
+