Orderable parts



  • Chipset Validation
  • FBGA Code
  • Op. Temp.
    -25C to +85C
  • Part Status
  • Product Longevity Program
  • Product Longevity Program Start Date

Data Sheets

8GB MLC e.MMC and 8Gb Mobile LPDDR3 in 221-Ball MCP (MT29TZZZ8D5JKEZB-107 W.95Q) Data Sheet

J95Q: 8GB (1 x L94C) e.MMC (PS8225 90s PB v5.0) and 8Gb LPDDR3 (1 x V01M)
  • File Type: PDF
  • Updated: 2016-12-22

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-00-09: Accelerate Design Cycles with Simulation Models

Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design.
  • File Type: PDF
  • Updated: 2010-02-09
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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