MT29TZZZ8D5BKFAH-125 W

Orderable parts

MT29TZZZ8D5BKFAH-125 W.95K

Specs

  • Chipset Validation
    N/A
  • FBGA Code
    JWA60
  • Op. Temp.
    -25C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A

Data Sheets

221-Ball MCP: MLC e·MMC and Mobile LPDDR3

8GB (2 x L83A) eMMC (ps8210 80s PB v4.51) and 8Gb LPDDR3 (2 x 2E0F) MT29TZZZ8D5BKFAH-125 W.95K (221b; J95K)
  • File Type: PDF
  • Updated: 2015-06-19

Simulation Models

IBIS model: 221-Ball MCP, MLC e·MMC and Mobile LPDDR3

MT29TZZZ8D4BKFRL-125 W.94K, MT29TZZZ8D5BKFAH-125 W.95K
  • File Type: ZIP
  • Updated: 2015-03-26

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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