MT29TZZZ8D5BKFAH-125 W

Orderable parts

MT29TZZZ8D5BKFAH-125 W.95K

Specs

  • Chipset Validation
    N/A
  • FBGA Code
    JWA60
  • Op. Temp.
    -25C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A

Data Sheets

221-Ball MCP: MLC e·MMC and Mobile LPDDR3

8GB (2 x L83A) eMMC (ps8210 80s PB v4.51) and 8Gb LPDDR3 (2 x 2E0F) MT29TZZZ8D5BKFAH-125 W.95K (221b; J95K)
  • File Type: PDF
  • Updated: 2020-04-17

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2020

Simulation Models

IBIS model: 221-Ball MCP, MLC e·MMC and Mobile LPDDR3

MT29TZZZ8D4BKFRL-125 W.94K, MT29TZZZ8D5BKFAH-125 W.95K
  • File Type: ZIP
  • Updated: 2015-03-26

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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