MT29TZZZ8D5BKFAH-125 W

Orderable parts

MT29TZZZ8D5BKFAH-125 W.95K

Specs

  • Chipset Validation
    N/A
  • FBGA Code
    JWA60
  • Op. Temp.
    -25C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A

Data Sheets

221-Ball MCP: MLC e·MMC and Mobile LPDDR3

8GB (2 x L83A) eMMC (ps8210 80s PB v4.51) and 8Gb LPDDR3 (2 x 2E0F) MT29TZZZ8D5BKFAH-125 W.95K (221b; J95K)
  • File Type: PDF
  • Updated: 2020-04-17

Simulation Models

IBIS model: 221-Ball MCP, MLC e·MMC and Mobile LPDDR3

MT29TZZZ8D4BKFRL-125 W.94K, MT29TZZZ8D5BKFAH-125 W.95K
  • File Type: ZIP
  • Updated: 2015-03-26

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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