MT29TZZZ5D6YKFAH-125 W

Orderable parts

MT29TZZZ5D6YKFAH-125 W.96N

Specs

  • Chipset Validation
    N/A
  • FBGA Code
    JY932
  • Op. Temp.
    -30C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A

Data Sheets

221-Ball MCP: MLC e·MMC and Mobile LPDDR3

16GB (2 x L84D) e·MMC (ps8222 80s PB v5.0) and 16Gb LPDDR3 (2 x V91M) MT29TZZZ5D6YKFAH-125 W.96N
  • File Type: PDF
  • Updated: 2015-04-22

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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