MT29TZZZ4D4BKERL-125 W

Orderable parts

MT29TZZZ4D4BKERL-125 W.94M

Specs

  • Chipset Validation
    N/A
  • FBGA Code
    JWB30
  • Op. Temp.
    -25C to +85C
  • Part Status
    Contact Factory
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A

Data Sheets

221-Ball MCP: MLC e·MMC and Mobile LPDDR3

4GB (1 x L83A) eMMC ( ps8210 80s PB v4.51) and 4Gb LPDDR3 (1 x 2E0F) MT29TZZZ4D4BKERL-125 W.94M
  • File Type: PDF
  • Updated: 2015-03-05

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2020

Simulation Models

IBIS model: 221-Ball MCP, MLC e·MMC and Mobile LPDDR3

MT29TZZZ4D4BKERL-125 W.94M
  • File Type: ZIP
  • Updated: 2014-02-05

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27
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