MT29PZZZ8D5BKFTF-18 W

Orderable parts

MT29PZZZ8D5BKFTF-18 W.95L

Specs

  • Chipset Validation
    N/A
  • FBGA Code
    JWB11
  • Op. Temp.
    -25C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A

Data Sheets

162-Ball MCP: MLC e.MMC and Mobile LPDDR2

8GB (2 x L83A) e.MMC (PS8210 80s PB v4.51) and 8Gb LPDDR2 (2 x 2E0E), MT29PZZZ8D5BKFTF-18 W.95L (162b; J95L)
  • File Type: PDF
  • Updated: 2016-05-31

Simulation Models

162-Ball 4GB/8GB MLC e·MMC + 8Gb x32 LPDDR2 MCP

MT29PZZZ8D4BKFSK-18 W.94L, MT29PZZZ8D5BKFTF-18 W.95L
  • File Type: ZIP
  • Updated: 2014-11-04

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
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