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NOR-Based MCP

Legacy Parallel NOR MCP with PSRAM or LPDDR

Our NOR-Based MCPs are legacy products and are not recommended for new designs. Please contact your local Sales Representative for additional information.

By Density

NOR Density DRAM Type DRAM Density Voltage Package Pin Count
128Mb PSRAM (Sync) 32Mb, 64Mb 1.8V TFBGA 88-ball, 56-ball
256Mb PSRAM (Sync), LPDDR 64Mb, 128Mb, 512Mb 1.8V TFBGA, VFBGA 88-ball, 56-ball, 133-ball
32Mb PSRAM (Sync), PSRAM (Async) 16Mb 1.8V TFBGA 52-ball, 88-ball
512Mb PSRAM (Sync), LPDDR 128Mb, 512Mb 1.8V VFBGA 56-ball, 133-ball
64Mb PSRAM (Async), PSRAM (Sync) 16Mb, 32Mb 1.8V TFBGA, VFBGA 88-ball, 52-ball
View Full NOR-Based MCP Part Catalog

Documentation

Frequently Asked Questions
Frequently asked questions (FAQs) about Micron's Multichip Packages.
  • Updated: 09/30/2015
Customer Service Note
The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

Resources

Brief/Flyer

Designers are increasingly turning to multichip package (MCP) solutions to achieve the smallest possible footprint while providing more density and better performance for IoT and M2M module designs.

Blog

As you’ve seen in the news in the last year; coming out of every major trade show there is another announcement about autonomous vehicles, also known as self-driving cars. We wanted to take a few minutes to explain Autonomous Driving progression, based on the SAE (Society of...

Blog

MCP’s or Multi Chip Packages as they are commonly referred to in the memory industry, are single packages with multiple memory devices inside. While the traditional definition of an MCP could include packages with multiple die of the same technology (like DRAM, NOR or NAND),...

Blog

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