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Whether you’re trying to minimize power consumption, maximize density, increase speed, or do everything at once, Micron’s NAND MCPs can drive your design no matter the application. Get the reliability your space-constrained design needs with our fully tested, stackable MCPs and PoPs in a variety of packages and technology options—and from a memory provider who manufactures all of the memory elements—including the NAND Flash and mobile LPDRAM.

By Density

NAND Density DRAM Type DRAM Density Pin Count Voltage Package
LPDDR2 n/a 162-ball 1.8V VFBGA
1Gb LPDDR2, LPDDR 512Mb 121-ball, 130-ball, 137-ball 1.8V, 1.7V-1.9V WFBGA, VFBGA, TFBGA
2Gb LPDDR2, LPDDR 1Gb 162-ball, 130-ball, 137-ball 1.8V, 1.7V-1.9V VFBGA, WFBGA, TFBGA
4Gb LPDDR3, LPDDR2, LPDDR 8Gb, 2Gb, 4Gb 221-ball, 162-ball, 137-ball, 168-ball, 130-ball 1.8V, 1.7V-1.9V WFBGA, VFBGA
8Gb LPDDR 4Gb 168-ball 1.7V-1.9V VFBGA
View Full NAND-based MCP Part Catalog

By Application


Frequently Asked Questions
Frequently asked questions (FAQs) about Micron's Multichip Packages.
  • Updated: 09/30/2015
Customer Service Note
The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.
  • File Type: PDF
  • Updated: 03/30/2017



A high-level comparison of our broad portfolio of e.MMC, and NAND MCPs.

  • File Type: PDF
  • Updated: 02/09/2017

A high-level comparison of our broad portfolio of NAND and e.MMC multichip package (MCP) memory solutions.


Designers are increasingly turning to multichip package (MCP) solutions to achieve the smallest possible footprint while providing more density and better performance for IoT and M2M module designs.


In late August, we announced our first ever mobile 3D NAND memory products, enabling our smartphone customers to pack in a lot more storage capacity into a smaller footprint. While bringing this new 3D architecture to mobile is significant, perhaps even more exciting was our...