Multichip Packages

Get the critical features and functions for your design—including high performance, high quality, power efficiency, wide density ranges, small package sizes, and industrial temperature ranges—from our broad portfolio of industry-standard multichip packages (MCPs).

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Product Family
Product Technology
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By Family

e.MMC-Based MCP
Quick look
Benefits
  • Embedded managed NAND and High Performance LPDRAM in a single package
  • Simplified software solutions for complex high density NAND applications
  • Technology
    e.MMC, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
  • Densities
    e.MMC: 4GB–32GB; LPDRAM: 4Gb–48Gb
  • Package
    WFBGA, VFBGA, TFBGA, POP
UFS-Based MCP (uMCP)
Quick look
Benefits
  • Embedded managed NAND and high-performance LPDRAM in a single package.
  • Enables high-density, low-power storage in a small footprint.
  • Technology
    LPDDR4 SDRAM, LPDDR4X SDRAM, UFS 3D NAND
  • Densities
    UFS: 32GB; LPDRAM: 24Gb (3GB)
  • Package
    WFBGA
NAND-Based MCP
Quick look
Benefits
  • Offers high densities for data-intensive applications
  • Provides high speeds, with x8, x16 and x32 bus widths
  • Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles
  • Technology
    LPDDR SDRAM, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
  • Densities
    NAND: 1Gb - 8Gb
  • Package
    WFBGA, VFBGA, TFBGA, POP
NOR-Based MCP
Quick look
Benefits

  • Simplifies design while speeding performance for low-density applications
  • Reduces active ball count by more than 50% thanks to shared-bus and A/D MUX options
  • Speeds boot-up and extends battery life with execute-in-place (XIP) functionality
  • Supports low-voltage applications (1.8V)
  • NOR Densities
    64Mb - 128Mb
  • Voltage
    1.8V
  • Package
    TFBGA, VFBGA

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