MTSD064AHC6MS-1WT

Orderable parts

MTSD064AHC6MS-1WT

Specs

  • Chipset Validation
    N/A
  • FBGA Code
    N/A
  • Model
    i200
  • Op. Temp.
    -25C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • READ
    90 MB/s
  • WRITE
    45 MB/s

Data Sheets

i200 microSDHC and microSDXC Card

MTSD032AHC6MS-1WT, MTSD064AHC6MS-1WT, MTSD128AHC6MS-1WT, MTSD256AHC6MS-1WT
  • File Type: PDF
  • Updated: 2021-03-02

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 7/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 7/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 7/1/2021

Technical Notes

TN-SD-02: Enabling SD/uSD Health Monitor System

This technical note describes how to enable the SD/uSD Health Monitor System
  • File Type: PDF
  • Updated: 2020-01-24

TN-SD-01: Enabling SD/uSD Card Lock/Unlock in Linux®

This technical note describes how to enable the SD/uSD Card Lock/Unlock feature in Linux®.
  • File Type: PDF
  • Updated: 2018-08-31

Customer Service Notes

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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