MTFC64GJVDN-3M WT

Orderable parts

MTFC64GJVDN-3M WT

Specs

  • Chipset Validation
    N/A
  • Density
    64GB
  • FBGA Code
    JW895
  • Op. Temp.
    -25C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Simulation Models

IBIS eMMC ESG WT (PS8200)

MTFC2GMTEA-0F WT, MTFC2GMVEA-L1 WT, MTFC2GMVEA-0M WT, MTFC2GMDEA-0M WT, MTFC4GLTEA-0F WT, MTFC4GLVEA-0M WT, MTFC4GLDEA-0M WT, MTFC4GMTEA-1F WT, MTFC4GMVEA-1M WT, MTFC4GMDEA-1M WT, MTFC8GLTEA-1F WT, MTFC8GLVEA-1M WT, MTFC8GLDEA-1M WT, MTFC16GLUAM-1M WT, MTFC16GJTEC-2F WT, MTFC16GJVEC-2M WT,MTFC16GJDEC-2M WT, MTFC16GJDEC-H1 WT, MTFC32GJTED-3F WT, MTFC32GJVED-3M WT, MTFC32GJDED-3M WT, MTFC64GJTDN-3F WT, MTFC64GJVDN-3M WT, MTFC64GJDDN-3M WT
  • File Type: ZIP
  • Updated: 2015-05-04

Technical Notes

TN-31-03: Best Practices for UFS Power Management

This technical note describes how to manage power up/off in customer systems that use Micron's Universal Flash Storage (UFS) 2.1 devices, as well as how to use the hardware reset function.
  • File Type: PDF
  • Updated: 2019-11-14

TN-29-85: UFS Memory Health Report for Mobile Devices

This technical note describes how to obtain the health report information for Micron's UFS devices.
  • File Type: PDF
  • Updated: 2019-05-10
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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