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Short-Reach HMC

Our short-reach (SR) Hybrid Memory Cube (HMC) SERDES PHY form factor provides data throughput unlike any other memory device on the market today. It’s designed for systems that use standard FBGA packaging and is an ideal point-to-point memory solution for ASIC, CPU, and ASSP devices.

Our SR HMC is available in a 31mm x 31mm package providing up to 160 GB/s bandwidth.

By Density

Density Interface Voltage Package Op. Temp.
2GB 15G SR 1.2V BGA 0C to +95C
View Full Short-Reach HMC Catalog

By Application

Performance

Performance

Memory and storage solutions that meet peak performance requirements.

Power Efficiency

Power Efficiency

Optimized energy efficiency that is key for next-generation supercomputers.

Resiliance

Resilience

Highly reliable, rigorously tested devices that meet the demand for efficiency and resiliency.

Big Bandwidth

Bandwidth

Delivers revolutionary results for networking applications.

Resources

Brief/Flyer

Learn how Micron networking solutions can help you build resilient, adaptable networks for tomorrow's demands.

  • File Type: PDF
  • Updated: 09/13/2016
Brief/Flyer

Overview of Micron’s Hybrid Memory Cube (HMC), including key benefits, applications, and specifications.

Brief/Flyer

This guide outlines Micron’s various solutions available for networking applications.

  • File Type: PDF
  • Updated: 06/23/2016