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Short-Reach HMC

Our short-reach (SR) Hybrid Memory Cube (HMC) SERDES PHY form factor provides data throughput unlike any other memory device on the market today. It’s designed for systems that use standard FBGA packaging and is an ideal point-to-point memory solution for ASIC, CPU, and ASSP devices.

Our SR HMC is available in a 31mm x 31mm package providing up to 160 GB/s bandwidth.

By Density

Density Interface Voltage Package Op. Temp.
2GB 15G SR 1.2V BGA 0C to +95C
View Full Short-Reach HMC Catalog

By Application



This guide outlines Micron’s various solutions available for networking applications.

  • File Type: PDF
  • Updated: 01/31/2017

Learn how Micron networking solutions can help you build resilient, adaptable networks for tomorrow's demands.

  • File Type: PDF
  • Updated: 09/13/2016

Overview of Micron’s Hybrid Memory Cube (HMC), including key benefits, applications, and specifications.