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Short-Reach HMC

Our short-reach (SR) Hybrid Memory Cube (HMC) SERDES PHY form factor provides data throughput unlike any other memory device on the market today. It’s designed for systems that use standard FBGA packaging and is an ideal point-to-point memory solution for ASIC, CPU, and ASSP devices.

Our SR HMC is available in two package sizes. The 31mm x 31mm package provides full 160 GB/s bandwidth. The 16mm x 19.5mm package is available for designs requiring a smaller form factor and is optimal for systems using less-than-full bandwidth.

By Density

Density Interface Voltage Package Op. Temp.
2GB 15G SR 1.2V BGA 0C to +95C
View Full Short-Reach HMC Catalog

By Application



Memory and storage solutions that meet peak performance requirements.

Power Efficiency

Power Efficiency

Optimized energy efficiency that is key for next-generation supercomputers.



Highly reliable, rigorously tested devices that meet the demand for efficiency and resiliency.

Big Bandwidth


Delivers revolutionary results for networking applications.


Search all Short-Reach HMC resources

Senior Architect of Advanced Memory, Richard Murphy, discusses system performance and HMC as the solution to the Memory Wall


A snapshot of industry trends, the role of memory, and what Micron has to offer for enterprise storage applications—from public and private cloud, virtualization, and big data, to de-duplication, data warehouseing, and data analytics.

  • File Type: PDF
  • Updated: 12/26/2014

This guide outlines Micron’s various solutions—from Hybrid Memory Cube and enterprise-class solid state drives (SSDs) to NVDIMMs—available for high-performance computing applications.

  • File Type: PDF
  • Updated: 11/05/2014