Cookie Information

We use cookies to improve the website experience of our users. To learn more about our cookies, visit our Cookies Policy page.


Add Bookmark(s)



Bookmark(s) shared successfully!

Please provide at least one email address.

Microchip background

Hybrid Memory Cube

With HMC, you can move data up to 15 times faster than with a DDR3 module and use up to 70% less energy and 90% less space than with existing memory technologies. And HMC’s abstracted interface and advanced reliability, availability, and serviceability (RAS) capabilities reduce complexity and deliver greater reliability—enabling your innovation and lowering your total cost of ownership like never before.

By Technology

Technology Benefits Densities Package Memory Bandwidth (MAX)
Short-Reach HMC Increases bandwidth
Reduces power
Increases reliability with RAS features
Simplifies design with abstracted  memory
Lowers TCO
2GB 31 x 31, 896-ball BGA 160 GB/s

Advanced Computing Solutions

Learn more about Micron’s Advanced Computing Solutions — the industry’s leading technology for high-performance computing. Built on FPGA technologies and targeted at PCI Express® (PCIe®)-based HPC or stand-alone embedded applications, our modular and highly scalable architecture solve the biggest big data computing challenges — from the edge to the cloud to the desktop.
Learn More