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Hybrid Memory Cube

With HMC, you can move data up to 15 times faster than with a DDR3 module and use up to 70% less energy and 90% less space than with existing memory technologies. And HMC’s abstracted interface and advanced reliability, availability, and serviceability (RAS) capabilities reduce complexity and deliver greater reliability—enabling your innovation and lowering your total cost of ownership like never before.

By Technology

Technology Benefits Densities Package Memory Bandwidth (MAX)
Short-Reach HMC Increases bandwidth
Reduces power
Increases reliability with RAS features
Simplifies design with abstracted  memory
Lowers TCO
2GB, 4GB 31 x 31, 896-ball BGA

16 x 19.5, 666-ball FBGA
120 GB/s, 160 GB/s


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Frequently Asked Questions

HMC Gen2 Frequently Asked Questions I2C SDA SCL JTAG Power BIST FW firmware reset revision pin time chain boards schematic P_RST_N advanced die temperature reserved stuck retry coupling Tx Rx AC DC errors RXPS PRBS package markings revision

  • File Type: PDF
  • Updated: 05/03/2016

Register Addendum for HMC Gen2 Data Sheet, Rev. E, 4/16

  • File Type: PDF
  • Updated: 04/06/2016


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We picked ten technologies representative of trends which we expect will redefine our industry in an increasingly interactive world. Admittedly, there are dozens of other examples we could have chosen with equal validity. We welcome your comments on our choices. A few...


Micron's Hybrid Memory Cube -- a 4 GByte stack of DRAM die on a 160 GByte/second interface now sampling to a few close partners -- almost didn't happen. The first prototype failed to make connections between the DRAM stack and a controller inside the package, forcing an...