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Hybrid Memory Cube

With HMC, you can move data up to 15 times faster than with a DDR3 module and use up to 70% less energy and 90% less space than with existing memory technologies. And HMC’s abstracted interface and advanced reliability, availability, and serviceability (RAS) capabilities reduce complexity and deliver greater reliability—enabling your innovation and lowering your total cost of ownership like never before.

By Technology

Technology Benefits Densities Package Memory Bandwidth (MAX)
Short-Reach HMC Increases bandwidth
Reduces power
Increases reliability with RAS features
Simplifies design with abstracted  memory
Lowers TCO
2GB 31 x 31, 896-ball BGA 160 GB/s

Resources

Brief/Flyer

Learn how Micron networking solutions can help you build resilient, adaptable networks for tomorrow's demands.

  • File Type: PDF
  • Updated: 09/13/2016
Brief/Flyer

Overview of Micron’s Hybrid Memory Cube (HMC), including key benefits, applications, and specifications.

Brief/Flyer

This guide outlines Micron’s various solutions available for networking applications.