MT61K256M32JE-14

Orderable parts

MT61K256M32JE-14:A

Specs

  • Chipset Validation
    N/A
  • Density
    8Gb
  • FBGA Code
    D9WCW
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    256Mb

Data Sheets

8Gb: 2 Channels x16/x8 GDDR6 SGRAM

MT61K256M32: 2 Channels x 256 Meg x 16 I/O, 2 Channels x 512 Meg x 8 I/O
  • File Type: PDF
  • Updated: 2019-10-13

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2020

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-ED-04: GDDR6 Design Guide

This technical note is designed to help designers implement GDDR6 as an off-the-shelf memory with established packaging, handling and testing. It outlines best practices for signal and power integrity, as well as standard GDDR6 DRAM features, to help system designs achieve the high data rates offered by GDDR6.
  • File Type: PDF
  • Updated: 2018-07-30

Customer Service Notes

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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