MT51J256M32HF-80

Orderable parts

MT51J256M32HF-80:B

Specs

  • Chipset Validation
    N/A
  • Density
    8Gb
  • FBGA Code
    D9VVR
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x32

Data Sheets

8Gb: x16, x32 GDDR5 SGRAM

8Gb: x16, x32 GDDR5 SGRAM
  • File Type: PDF
  • Updated: 2017-02-02

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 9/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 9/1/2019

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-ED-04: GDDR6 Design Guide

This technical note is designed to help designers implement GDDR6 as an off-the-shelf memory with established packaging, handling and testing. It outlines best practices for signal and power integrity, as well as standard GDDR6 DRAM features, to help system designs achieve the high data rates offered by GDDR6.
  • File Type: PDF
  • Updated: 2018-07-30

Customer Service Notes

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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