MT48LC8M16A2B4-6A XIT

Orderable parts

MT48LC8M16A2B4-6A XIT:L

Specs

  • Chipset Validation
    N/A
  • Data Rate
    PC133
  • Density
    128Mb
  • FBGA Code
    D9QXT
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • PLP
    Yes
  • PLP Start Date
    N/A
  • Width
    x16

Data Sheets

128Mb: x4, x8, x16 SDRAM

  • File Type: PDF
  • Updated: 2014-09-09T05:00:00.0000000Z

128Mb: x4, x8, x16 SDRAM Addendum

  • File Type: PDF
  • Updated: 2014-03-20T16:05:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2019

Simulation Models

HSpice

2.0 (Die Rev. L)
  • File Type: ZIP
  • Updated: 2011-08-26T00:00:00.0000000Z

IBIS

2.0 (Die Rev. L)
  • File Type: ZIP
  • Updated: 2011-08-26T00:00:00.0000000Z

64Mb - 512Mb SDRAM Verilog Model

Revision 2.3
  • File Type: ZIP
  • Updated: 2016-05-12T00:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17T15:39:00.0000000Z

TN-00-19: Thinning Considerations for Wafer Products

This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.
  • File Type: PDF
  • Updated: 2009-10-15T00:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
+