MT48LC32M8A2P-6A

Orderable parts

MT48LC32M8A2P-6A:D
MT48LC32M8A2P-6A:G

Specs

  • Chipset Validation
    N/A
  • Data Rate
    PC133
  • Density
    256Mb
  • FBGA Code
    N/A
  • Op. Temp.
    0C to +70C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8
  • Chipset Validation
    N/A
  • Data Rate
    PC133
  • Density
    256Mb
  • FBGA Code
    D9NNT
  • Op. Temp.
    0C to +70C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

256Mb: x4, x8, x16 SDRAM

  • File Type: PDF
  • Updated: 2015-05-20

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 2/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 2/1/2020

Simulation Models

HSpice

2.0 (Die Rev. G)
  • File Type: ZIP
  • Updated: 2011-07-21

HSpice

2.1 (Die Rev. D)
  • File Type: ZIP
  • Updated: 2006-06-09

IBIS

2.0 (Die Rev. G)
  • File Type: ZIP
  • Updated: 2019-09-03

IBIS

2.3 (Die Rev. D)
  • File Type: ZIP
  • Updated: 2006-06-09

64Mb - 512Mb SDRAM Verilog Model

Revision 2.3
  • File Type: ZIP
  • Updated: 2016-05-12

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-48-15: Backward Compatibility for Faster SDRAM

This technical note reviews the timing differences between SDRAM generations and shows how the faster Micron parts are compatible with the slower parts.
  • File Type: PDF
  • Updated: 2005-10-16
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27
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