MT44K32M36RB-093E

Orderable parts

MT44K32M36RB-093E:A

Specs

  • Chipset Validation
    N/A
  • Density
    1.125Gb
  • FBGA Code
    D9THP
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 3
  • Width
    x36

Data Sheets

1.125Gb: x18, x36 RLDRAM 3

  • File Type: PDF
  • Updated: 2019-01-18

1.125Gb: x18, x36 RLDRAM 3 Errata

  • File Type: PDF
  • Updated: 2016-09-21

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 8/1/2022

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 8/1/2022

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 8/1/2022

Simulation Models

IBIS

Rev 2.0 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2016-09-12

HSPICE

Rev 2.0 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2016-09-12

RLDRAM 3 Verilog Model

(Rev 1.20)
  • File Type: ZIP
  • Updated: 2015-05-07

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-44-01: RLDRAM 3 Design Guide

Contains practical recommendations for developing high-performance memory subsystems while ensuring stability for long-term reliable operation of the devices.
  • File Type: PDF
  • Updated: 2011-08-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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