MT44K32M18RB-125E IT

Orderable parts

MT44K32M18RB-125E IT:A

Specs

  • Chipset Validation
    N/A
  • Density
    576Mb
  • FBGA Code
    D9PNF
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 3
  • Width
    x18

Data Sheets

576Mb: x18, x36 RLDRAM 3

  • File Type: PDF
  • Updated: 2019-01-18

Simulation Models

MT44K32M18 Rev B1.0 BSDL

  • File Type: TXT
  • Updated: 2016-12-01

MT44K32M18 Rev A 1.1 BSDL

  • File Type: TXT
  • Updated: 2012-07-12

HSpice

Rev 2.1 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2012-10-11

IBIS

Rev 2.0 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2012-03-15

RLDRAM 3 Verilog Model

(Rev 1.20)
  • File Type: ZIP
  • Updated: 2015-05-07

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-49-02: Exploring the RLDRAM 2 Feature Set

This technical note outlines the performance-enhancing features offered by RLDRAM 2 architecture.
  • File Type: PDF
  • Updated: 2012-10-04
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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