MT44K16M36RB-125F

Orderable parts

Specs

Data Sheets

576Mb: x18, x36 RLDRAM 3

  • File Type: PDF
  • Updated: 2019-01-18

Simulation Models

MT44K16M36 Rev B BSDL

  • File Type: TXT
  • Updated: 2016-12-01

MT44K16M36 Rev A BSDL

  • File Type: TXT
  • Updated: 2012-09-03

HSpice

Rev 2.1 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2012-10-11

IBIS

Rev 2.0 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2012-03-15

RLDRAM 3 Verilog Model

(Rev 1.20)
  • File Type: ZIP
  • Updated: 2015-05-07

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-44-01: RLDRAM 3 Design Guide

Contains practical recommendations for developing high-performance memory subsystems while ensuring stability for long-term reliable operation of the devices.
  • File Type: PDF
  • Updated: 2011-08-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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