MT49H8M36BM-18

Orderable parts

MT49H8M36BM-18:B

Specs

  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    D9NCT
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x36

Data Sheets

288Mb: x36, x18, x9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM 2

  • File Type: PDF
  • Updated: 2015-10-09T05:00:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 3/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 3/1/2019

Simulation Models

BSDL Rev 1.0 (Die Rev B)

  • File Type: TXT
  • Updated: 2011-09-22T00:00:00.0000000Z

IBIS

REV 2.5 (Die Rev B)
  • File Type: ZIP
  • Updated: 2015-08-12T05:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2018-02-15T06:00:00.0000000Z

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2018-10-12T05:00:00.0000000Z

Micron 95nm Legacy 256Mb and 512Mb DRAM Component Update

Describes certain legacy products.
  • File Type: PDF
  • Updated: 2015-01-09T06:00:00.0000000Z
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