MT49H32M9FM-33

Orderable parts

MT49H32M9FM-33
MT49H32M9FM-33:B

Specs

  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    DQJMS
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x9
  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    D9NDJ
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x9

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 3/1/2019

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2018-02-15T06:00:00.0000000Z

TN-44-01: RLDRAM 3 Design Guide

Contains practical recommendations for developing high-performance memory subsystems while ensuring stability for long-term reliable operation of the devices.
  • File Type: PDF
  • Updated: 2011-08-26T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2018-10-12T05:00:00.0000000Z

Micron 95nm Legacy 256Mb and 512Mb DRAM Component Update

Describes certain legacy products.
  • File Type: PDF
  • Updated: 2015-01-09T06:00:00.0000000Z
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