MT49H16M36FM-25 IT

Orderable parts

MT49H16M36FM-25 IT:B

Specs

  • Chipset Validation
    N/A
  • Density
    576Mb
  • FBGA Code
    D9NJG
  • Op. Temp.
    -40C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x36

Data Sheets

576Mb: x9 x18 x36 CIO RLDRAM 2

  • File Type: PDF
  • Updated: 2015-09-14

Simulation Models

IBIS

REV 2.5 (Die Rev B)
  • File Type: ZIP
  • Updated: 2015-08-12

HSpice

REV 2.1 (Die Rev B)
  • File Type: ZIP
  • Updated: 2011-07-27

BSDL

REV 1.0 (Die Rev B)
  • File Type: ZIP
  • Updated: 2011-06-23

BSDL

REV 1.0 (Die Rev B)
  • File Type: ZIP
  • Updated: 2011-06-23

Verilog

3.12
  • File Type: ZIP
  • Updated: 2009-12-17

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-49-03: RLDRAM 2 Clocking Strategies

This technical note addresses the operation of the RLDRAM 2 device outside the specified range of clock periods and the timing changes that occur in this mode of operation.
  • File Type: PDF
  • Updated: 2012-10-04
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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