MT49H16M18CFM-33

Orderable parts

MT49H16M18CFM-33

Specs

  • Chipset Validation
    N/A
  • Density
    288Mb
  • FBGA Code
    D9BPJ
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 2
  • Width
    x18

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-44-01: RLDRAM 3 Design Guide

Contains practical recommendations for developing high-performance memory subsystems while ensuring stability for long-term reliable operation of the devices.
  • File Type: PDF
  • Updated: 2011-08-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-37: Micron 95nm Legacy 256Mb and 512Mb DRAM Component Update

Describes certain legacy products.
  • File Type: PDF
  • Updated: 2015-01-09
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