MT53B768M32D4DT-062 AIT

Orderable parts

MT53B768M32D4DT-062 AIT:B

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR4-3200
  • Density
    24Gb
  • FBGA Code
    D9VZM
  • Op. Temp.
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x32

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 02/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 02/2019

Simulation Models

Z0AM IBIS

Z0AM Mobile LPDDR4 SDRAM, Die Rev. B, Partial PNs: MT53B384M32D2NP-062 AAT:B, MT53B384M32D2NP-062 AIT:B, MT53B384M32D2NP-062 AUT:B, MT53B768M32D4NQ-062 AIT:B
  • File Type: ZIP
  • Updated: 1/7/2019

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 12/15/2009

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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