MT48H16M16LFBF-75 AT

Orderable parts

MT48H16M16LFBF-75 AT:H

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    7.5ns
  • Data Rate
  • Density
    256Mb
  • FBGA Code
    D9LDH
  • Op. Temp.
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPSDR
  • Width
    x16

Data Sheets

256Mb: 16 Meg x 16, 8 Meg x 32 Mobile LPSDR (Recommended for New Designs)

  • File Type: PDF
  • Updated: 2010-09-17

Simulation Models

HSpice

2.1 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2009-04-13

IBIS

2.1 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2009-04-10

Verilog

6.1
  • File Type: ZIP
  • Updated: 2009-05-20

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
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