MT46H8M32LFB5-6

Orderable parts

MT46H8M32LFB5-6:A
MT46H8M32LFB5-6:H

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    6ns
  • Data Rate
    LPDDR333
  • Density
    256Mb
  • FBGA Code
    D9FSD
  • Op. Temp.
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR
  • Width
    x32
  • Chipset Validation
    N/A
  • Cycle Time
    6ns
  • Data Rate
    LPDDR333
  • Density
    256Mb
  • FBGA Code
    D9JRP
  • Op. Temp.
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR
  • Width
    x32

Data Sheets

256Mb: x16, x32 Mobile LPDDR SDRAM (Recommended for new designs)

  • File Type: PDF
  • Updated: 2010-09-17

256Mb: 16 Meg x 16, 8 Meg x 32 Mobile LPDDR SDRAM

  • File Type: PDF
  • Updated: 2008-07-01

Simulation Models

HSpice

2.1 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2009-05-04

HSpice

2.2 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2007-09-12

IBIS

2.1 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2009-05-04

IBIS

2.2 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2007-09-12

LPDDR Verilog Model

6.05
  • File Type: ZIP
  • Updated: 2011-04-04

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
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