MT46H256M32L4JV-5 IT

Orderable parts

MT46H256M32L4JV-5 IT:B

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    5ns
  • Data Rate
    LPDDR400
  • Density
    8Gb
  • FBGA Code
    D9QSV
  • Op. Temp.
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR
  • Width
    x32

Data Sheets

2Gb: x16, x32 Mobile LPDDR SDRAM

  • File Type: PDF
  • Updated: 2014-01-31

Simulation Models

HSpice: 2Gb Mobile LPDDR T79M

Revision 2.1, Die Rev. B
  • File Type: ZIP
  • Updated: 2012-01-05

HSpice: 2Gb Mobile LPDDR T69M

HSpice simulation model for the 2Gb Mobile LPDDR 50nm (T69M) products Rev. 2.1
  • File Type: ZIP
  • Updated: 2010-10-08

IBIS: 2Gb Mobile LPDDR T79M

Revision 2.1, Die Rev. B
  • File Type: ZIP
  • Updated: 2012-01-05

IBIS: 2Gb Mobile LPDDR T69M

IBIS driver model for the 2Gb Mobile LPDDR 50nm (T69M) products Rev. 2.1
  • File Type: ZIP
  • Updated: 2010-10-08

LPDDR Verilog Model

6.05
  • File Type: ZIP
  • Updated: 2011-04-04

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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