MT46H128M32L2KQ-5 IT

Orderable parts

MT46H128M32L2KQ-5 IT:B


  • Chipset Validation
  • Cycle Time
  • Data Rate
  • Density
  • FBGA Code
  • Op. Temp.
  • Part Status
  • PLP
  • PLP Start Date
  • Technology
  • Width

Data Sheets

2Gb: x16, x32 Mobile LPDDR SDRAM

  • File Type: PDF
  • Updated: 2014-01-31T16:42:00.0000000Z


China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2019

Simulation Models

LPDDR Verilog Model

  • File Type: ZIP
  • Updated: 2011-04-04T00:00:00.0000000Z

HSpice: 2Gb Mobile LPDDR T79M

Revision 2.1, Die Rev. B
  • File Type: ZIP
  • Updated: 2012-01-05T00:00:00.0000000Z

HSpice: 2Gb Mobile LPDDR T69M

HSpice simulation model for the 2Gb Mobile LPDDR 50nm (T69M) products Rev. 2.1
  • File Type: ZIP
  • Updated: 2010-10-08T00:00:00.0000000Z

IBIS: 2Gb Mobile LPDDR T79M

Revision 2.1, Die Rev. B
  • File Type: ZIP
  • Updated: 2012-01-05T00:00:00.0000000Z


Die Rev. C
  • File Type: ZIP
  • Updated: 2014-11-21T00:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2018-02-15T06:00:00.0000000Z

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15T00:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2018-10-12T05:00:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z