MT42L32M16D1AB-25 IT

Orderable parts


Simulation Models

HSpice: 512Mb Mobile LPDDR2 U67M

Rev. 2.4
  • File Type: ZIP
  • Updated: 2015-04-15

IBIS: 512Mb Mobile LPDDR2 U67M

Rev 2.4
  • File Type: ZIP
  • Updated: 2015-04-15

LPDDR2 Verilog Model

Version 0.96
  • File Type: ZIP
  • Updated: 2013-02-27

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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