MT42L16M32D1AC-25 AIT

Orderable parts

Specs

Simulation Models

HSpice: 512Mb Mobile LPDDR2 U67M

Rev. 2.4
  • File Type: ZIP
  • Updated: 2015-04-15

IBIS: 512Mb Mobile LPDDR2 U67M

Rev 2.4
  • File Type: ZIP
  • Updated: 2015-04-15

LPDDR2 Verilog Model

Version 0.96
  • File Type: ZIP
  • Updated: 2013-02-27

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
See All
+