EDF8132A3PB-JD-F

Orderable parts

EDF8132A3PB-JD-F-D
EDF8132A3PB-JD-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1866
  • Density
    8Gb
  • FBGA Code
    N/A
  • Op. Temp.
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x32
  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1866
  • Density
    8Gb
  • FBGA Code
    N/A
  • Op. Temp.
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x32

Data Sheets

Production Data Sheet: 216-Ball Single-Channel 2E0F Mobile LPDDR3 SDRAM

216-Ball, 12x12, DDP, 3DP, QDP, Single-Channel, LPDDR3 SDRAM
  • File Type: PDF
  • Updated: 2014-10-07

Simulation Models

IBIS: 216-Ball 2E0F DDP 12x12 1ch Mobile LPDDR3 SDRAM

Rev 1.0 216-Ball, DDP, Single-Channel, LPDDR3 SDRAM
  • File Type: ZIP
  • Updated: 2014-09-02

Verilog: 4Gb Mobile LPDDR3 2E0F

Verilog simulation model for 4Gb Mobile LPDDR3
  • File Type: ZIP
  • Updated: 2018-01-23

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
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