EDBM164B1PD-1D-F

Orderable parts

EDBM164B1PD-1D-F-D
EDBM164B1PD-1D-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    12Gb
  • FBGA Code
    N/A
  • Op. Temp.
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x64
  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    12Gb
  • FBGA Code
    N/A
  • Op. Temp.
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x64

Data Sheets

Preliminary Data Sheet: 220-ball 2C0E Mobile LPDDR2 SDRAM

12Gb PoP, 14mm x 14mm, 220-ball FBGA
  • File Type: PDF
  • Updated: 2014-02-26

Simulation Models

IBIS: 220-Ball 2C0E 3DP Mobile LPDDR2 SDRAM

Rev 1.0
  • File Type: ZIP
  • Updated: 2014-02-28

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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