EDB8164B3PF-1D-F

Orderable parts

EDB8164B3PF-1D-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    8Gb
  • FBGA Code
    N/A
  • Op. Temp.
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x64

Data Sheets

Production Data Sheet: 216-ball 2C0E Mobile LPDDR2 SDRAM

8Gb, PoP, 12mm x 12mm, 216-ball FBGA
  • File Type: PDF
  • Updated: 2014-02-26

Simulation Models

IBIS: 216-Ball 2C0E DDP Mobile LPDDR2 SDRAM

Rev 1.0
  • File Type: ZIP
  • Updated: 2014-02-28

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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