EDB2432B4MA-1DIT-F

Orderable parts

EDB2432B4MA-1DIT-F-D
EDB2432B4MA-1DIT-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    2Gb
  • FBGA Code
    D9WVJ
  • Op. Temp.
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x32
  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    2Gb
  • FBGA Code
    D9WVK
  • Op. Temp.
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x32

Data Sheets

1Gbit, 2Gbit, 4Gbit U98M Embedded LPDDR2 SDRAM Data Sheet

EDB1316BD (1Gb/2KB - single die, x16), EDB1332BD (1Gb/2KB - single die, x32), EDB2432B4 (2Gb/2KB - dual die, x32), EDB4064B4 (4Gb/2KB - quad die, x64)
  • File Type: PDF
  • Updated: 11/17/2016

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/2018

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/2018

SIM Models

HSPICE: U98M Mobile LPDDR2 SDRAM

HSPICE for U98M AT, IT, UT, WT
  • File Type: ZIP
  • Updated: 6/20/2016

IBIS: U98M Mobile LPDDR2 SDRAM

Rev 1.1; Temp ranges supported= AT, IT, UT, WT, XT
  • File Type: ZIP
  • Updated: 6/12/2016

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 3/23/2011

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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