EDB1332BDBH-1DAAT-F

Orderable parts

EDB1332BDBH-1DAAT-F-D
EDB1332BDBH-1DAAT-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    1Gb
  • FBGA Code
    D9WTV
  • Op. Temp.
  • Part Status
    Production
  • Product Longevity Program
    Yes
  • Product Longevity Program Start Date
    4/1/2014
  • Technology
    LPDDR2
  • Width
    x32
  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    1Gb
  • FBGA Code
    D9WTW
  • Op. Temp.
  • Part Status
    Production
  • Product Longevity Program
    Yes
  • Product Longevity Program Start Date
    4/1/2014
  • Technology
    LPDDR2
  • Width
    x32

Data Sheets

1Gbit Automotive LPDDR2 SDRAM data sheet

EDB1332BD, EDB1316BD, EDB2432B4 (U98M IT/AT/UT)
  • File Type: PDF
  • Updated: 2018-05-15

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2019

Simulation Models

HSPICE: U98M Mobile LPDDR2 SDRAM

HSPICE for U98M AT, IT, UT, WT
  • File Type: ZIP
  • Updated: 2016-06-20

IBIS: U98M Mobile LPDDR2 SDRAM

Rev 1.1; Temp ranges supported= AT, IT, UT, WT, XT
  • File Type: ZIP
  • Updated: 2016-06-12

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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