MT53E128M32D2DS-053 AAT

Orderable parts

MT53E128M32D2DS-053 AAT:A

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR4-3732
  • Density
    4Gb
  • FBGA Code
    D9WSC
  • Op. Temp.
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x32

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 7/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 7/1/2019

Simulation Models

HSPICE: 2Gb Mobile LPDDR4 Z19M

WT, UT, AT, IT, XT, Z19M Mobile LPDDR4 SDRAM, Die Rev. A, 200b, MT53D128M16D1, MT53D128M32D2
  • File Type: ZIP
  • Updated: 2019-05-20

IBIS: 2Gb Mobile LPDDR4 Z19M

WT, UT, AT, IT, XT, Z19M Mobile LPDDR4 SDRAM, Die Rev. A, 200b, MT53D128M16D1, MT53D128M32D2
  • File Type: ZIP
  • Updated: 2018-12-21

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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