MT46H64M32LFBQ-48 AIT

Orderable parts

MT46H64M32LFBQ-48 AIT:C

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    5ns
  • Data Rate
    LPDDR416
  • Density
    2Gb
  • FBGA Code
    D9RWK
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR
  • Width
    x32

Data Sheets

2Gb: x16, x32 Automotive LPDDR SDRAM

MT46H128M16LF, MT46H64M32LF
  • File Type: PDF
  • Updated: 2018-05-30

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 2/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 2/1/2020

Simulation Models

HSpice

Die Rev. C
  • File Type: ZIP
  • Updated: 2013-11-18

IBIS

Die Rev. C
  • File Type: ZIP
  • Updated: 2014-11-21

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27
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