EDFP112A3PF-JD-F

Orderable parts

EDFP112A3PF-JD-F-D
EDFP112A3PF-JD-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1866
  • Density
    24Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +85C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x128
  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1866
  • Density
    24Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +85C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x128

Data Sheets

Production Data Sheet: V9AM 504-Ball 24Gb Mobile LPDDR3 SDRAM (4 x 6Gb)

504-Ball, QDP, Quad-Channel, LPDDR3 SDRAM (Zht=0.7mm)
  • File Type: PDF
  • Updated: 2015-02-06

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2020

Simulation Models

Verilog: 6Gb Mobile LPDDR3 V9AM

Verilog simulation model for 6Gb Mobile LPDDR3
  • File Type: ZIP
  • Updated: 2018-01-23

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-00-09: Accelerate Design Cycles with Simulation Models

Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design.
  • File Type: PDF
  • Updated: 2010-02-09
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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