EDFP112A3PF-GDTJ-F

Orderable parts

EDFP112A3PF-GDTJ-F-D
EDFP112A3PF-GDTJ-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1600
  • Density
    24Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +105C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x128
  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1600
  • Density
    24Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +105C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x128

Data Sheets

Production Data Sheet: V9AM 504-Ball 24Gb Mobile LPDDR3 SDRAM (4 x 6Gb)

504-Ball, QDP, Quad-Channel, LPDDR3 SDRAM (Zht=0.7mm)
  • File Type: PDF
  • Updated: 2015-02-06

Simulation Models

Verilog: 6Gb Mobile LPDDR3 V9AM

Verilog simulation model for 6Gb Mobile LPDDR3
  • File Type: ZIP
  • Updated: 2018-01-23

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-37: Micron 95nm Legacy 256Mb and 512Mb DRAM Component Update

Describes certain legacy products.
  • File Type: PDF
  • Updated: 2015-01-09
See All
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