EDFP112A3PD-GD-F

Orderable parts

EDFP112A3PD-GD-F-D
EDFP112A3PD-GD-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1600
  • Density
    24Gb
  • FBGA Code
    N/A
  • Op. Temp.
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x128
  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1600
  • Density
    24Gb
  • FBGA Code
    N/A
  • Op. Temp.
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x128

Data Sheets

Preliminary Data Sheet: V9AM 24Gb: 396-Ball, 4 x 6Gb, Dual-Channel LPDDR3

396-Ball, QDP, Dual-Channel, LPDDR3 SDRAM
  • File Type: PDF
  • Updated: 2014-10-07

Simulation Models

IBIS: 396-Ball V9AM Mobile LPDDR3 SDRAM

Rev 1.0 396-Ball, QDP, Dual-Channel, LPDDR3 SDRAM
  • File Type: ZIP
  • Updated: 2014-08-31

Verilog: 6Gb Mobile LPDDR3 V9AM

Verilog simulation model for 6Gb Mobile LPDDR3
  • File Type: ZIP
  • Updated: 2018-01-23

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
See All
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