EDFA164A2MA-GD-F

Orderable parts

EDFA164A2MA-GD-F-D
EDFA164A2MA-GD-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1600
  • Density
    16Gb
  • FBGA Code
    N/A
  • Op. Temp.
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x64
  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1600
  • Density
    16Gb
  • FBGA Code
    N/A
  • Op. Temp.
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x64

Data Sheets

Production Data Sheet: 8Gb, 16Gb: 253-Ball, Dual-Channel 2E0F Mobile LPDDR3 SDRAM

253-ball, 11x11, DDP, QDP, Dual-Channel, LPDDR3 SDRAM
  • File Type: PDF
  • Updated: 2015-02-24T06:00:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 6/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 6/1/2019

Simulation Models

IBIS: 253-Ball 2E0F QDP Mobile LPDDR3 SDRAM

Rev 1.1 253-ball, QDP, Dual-Channel, LPDDR3 SDRAM
  • File Type: ZIP
  • Updated: 2014-09-02T05:00:00.0000000Z

Verilog: 4Gb Mobile LPDDR3 2E0F

Verilog simulation model for 4Gb Mobile LPDDR3
  • File Type: ZIP
  • Updated: 2018-01-23T06:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17T15:39:00.0000000Z

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23T05:00:00.0000000Z

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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